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Stannol Sn99,3Cu0,7NiGe SN100C 1kg tyčový cín STANNOL Tyčový cin Sn99,3Cu0,7NiGe SN100C 1kg STANNOL.. Product #: 330102

Sn99,3Cu0,7NiGe SN100C 1kg tyčový cín STANNOL

Sn99,3Cu0,7NiGe SN100C 1kg tyčový cín STANNOL

Výrobca: Stannol
Kód produktu: 330102
Cena na vyžiadanie: +421 918 511584

Tyčový cin Sn99,3Cu0,7NiGe SN100C 1kg STANNOL


SN100C is a silver-free, eutectic lead-free solder, based on Sn99.3Cu0.7 and conforms analogous to ISO 9453:2006 (alloy number 401) with micro-alloyed additives (<500ppm). The SN100C has been developed and patented by NIHON Superior, licenced and produced by STANNOL. This solder shows due to his formulation with micro alloying elements like nickel and germanium unique properties in all applications.

The SN100C alloy is a micro alloyed solder, based on the eutectic Sn99.3Cu0.7 alloy. This world-wide accepted and very often used alloy reduces the dross formation as well as the copper leaching from PCBs and components into the solder bath effectively.

Product Advantages

  • Finer grain structure and shinier surface than conventional Sn99.3Cu0.7 alloys
  • Eutectic alloy (defined melting point at 227°C)
  • Reduction of dross formation - saves money
  • Very good wetting characteristics
  • Highly reduced dissolution rate of copper and other metals in comparison with conventional Sn99Cu1 alloys and as a result significantly increased service lives of the solder baths
  • Reduction of defect rate due to much lower tendency to form bridging and icicles
  • Optimum working temperatures from 260-270°C
  • SN100Ce is the copper-free version of the micro-allying solder. This re-fill solder can be used, if the copper content in used solder baths is too high and needs to be reduced to the accepted level of 0.5-0.9%



SN100C and SN100Ce are manufactured in various rod and bar forms, as well as pellets and solid wire.



The use of SN100C as wave solder requires a solder bath temperature of approx. 260 to 270 °C. The use of inert gas means a significant extension of the process window, but is not necessarily required. The wetting of the solder is made easier and on exit from the wave, no excess solder remains attached to the components. Bridging and icicle formation is drastically reduced. The dross formation is also considerably minimised. SN100C can also be used at higher temperatures in selective soldering systems.


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